Compatibility: Compatible with all standard SDR / DDR / DDR II memory modules Heatsink Dimensions: Base: 22 x 10mm Height: 9mm Features: Qty: 8pcs High Conductivity Thermal Pad One-piece copper structure for superior heat conductivity Higher fin ratio and thinner fin thickness to speed up thermal dissipation Dissipate BGA/RAM chipset heat improving its graphic performance Avoid system crash caused by chipset overheat Meet User-friendly Design Efficient size and Easy to install Parts: 1 year limited Labor: 1 year limited